Microstructure control and property switching in stress-free van der Waals epitaxial VO<sub>2</sub> films on mica - Labex INTERACTIFS - Interactions and transfers at fluids and solids interfaces
Article Dans Une Revue Materials & Design Année : 2023

Microstructure control and property switching in stress-free van der Waals epitaxial VO2 films on mica

Résumé

Realizing stress-free inorganic epitaxial films on weakly bonding substrates is of importance for applications that require film transfer onto surfaces that do not seed epitaxy. Film-substrate bonding is usually weakened by harnessing natural van der Waals layers (e.g., graphene) on substrate surfaces, but this is difficult to achieve in non-layered materials. Here, we demonstrate van der Waals epitaxy of stress-free films of a non-layered material VO2 on mica. The films exhibit out-of-plane 010 texture with three in-plane orientations inherited from the crystallographic domains of the substrate. The lattice parameters are invariant with film thickness, indicating weak film-substrate bonding and complete interfacial stress relaxation. The out-of-plane domain size scales monotonically with film thickness, but the in-plane domain size exhibits a minimum, indicating that the nucleation of large in-plane domains supports subsequent island growth. Complementary ab initio investigations suggest that VO2 nucleation and van der Waals epitaxy involves subtle polarization effects around, and the active participation of, surface potassium atoms on the mica surface. The VO2 films show a narrow domain-size-sensitive electrical-conductivity-temperature hysteresis. These results offer promise for tuning the properties of stress-free van der Waals epitaxial films of non-layered materials such as VO2 through microstructure control.
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hal-04521143 , version 1 (30-09-2024)

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Erik Ekström, S. Hurand, Arnaud Le Febvrier, Anna Elsukova, Per O.Å. Persson, et al.. Microstructure control and property switching in stress-free van der Waals epitaxial VO2 films on mica. Materials & Design, 2023, 229, pp.111864. ⟨10.1016/j.matdes.2023.111864⟩. ⟨hal-04521143⟩
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